realme X9 Pro is a new smartphone from Realme which is expected to be launched in China soon. This smartphone will be one of the first devices to be powered by MediaTek’s most powerful mobile chipset.
While waiting for the launch date, pictures of the X9 Pro Realm Special Edition have been posted on the Internet. Photos reported as Realme X9 Pro Master Edition were posted on Weibo by a leaker who goes by the nickname “WHYLAB”.
According to WHYLAB, Realme will collaborate again with Naoto Fukasawa to design the smartphone. As we already know, Fukusawa is the same designer who has previously worked with Realme on Master Editon smartphones.
For the Realme X9 Pro Master Edition, the manufacturer uses the “cement” coating used for the realme X2 Pro Master Edition 2019 version. The device has a curved screen, the first one for real, and a punch-hole in the top left. Corner. The screen measures 6.55 inches and has a 90Hz refresh rate.
There are three cameras at the back of the device and all of them are stacked inside a black housing with a tablet-shaped LED flash. There is a 4,500 mAh battery under the gray back panel and the device is also said to support 65W fast charging.
Leaked photos shared by WHYLAB also reveal that the smartphone has a plastic frame and is 7.8 millimeters thick. Unfortunately, there has been no confirmation from Realme about the screen panel used. However, it is anticipated that the X9 Pro will use the Realm AMOLED screen panel.
The X9 Pro appears to be the second of two Realm devices powered by the Dimension 1200. Another smartphone is the Realm GT Neo, which earlier this month revealed some specifics at the launch of the Realm GT powered by the Snapdragon 888. It is not yet known which of the two devices will be announced first.
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